The essence of the Industrial sector is to enable seamless connectivity in our environment. Connectivity goes beyond our homes, focusing on industrial infrastructure and power. New-age silicon for advanced sensors and gateways enable devices to work faster, with better ability to integrate with enterprise frameworks. It has built expertise in power management, computing, and networking chipsets to bring value to this sector. To take it a step further our embedded team takes this knowledge to build energy meters, industrial grade cameras, and server grade systems.
From enhancing devices that bolster connectivity to system engineering that bring seamless integration of enterprise products, we interconnect the dots of silicon engineering for the intelligent globe.
Seamlessly connected infrastructure, better sensory equipment for automotive and avionics, even medical sensors – it’s where industrial power can bring for intelligence to the environment that surrounds us. However, the road to the second industrial evolution depends on advanced and high performing chip supported devices like cameras, VR headsets, microcontrollers, sensors connectivity, and memory. With our vast experience in varied industry verticals and scenarios, we are perfectly poised to support the emerging needs of industrial solution providers
Tessolve introduces a SMARC 2.1 SoM (System-On-Module) based on the TI AM62x Sitara series of processors. High-performance processor core includes Quad Arm® Cortex® - A53 cores operating at 1.4 GHz, single-core Arm® Cortex®-R5F at 400 MHz and Single-core Arm® Cortex®-M4F MCU at 400 MHz.
TI AM62x chipset is AEC-Q100 qualified supports ASIL D system designs and supports secure boot for IP protection with the built-in HSM (Hardware Security Module).
Tessolve leverages its vast experience of product development in automotive and industrial domains all the way from conceptualization to manufacturing to develop AM62x based SOM and Display system application board and solutions.
The Tessolve AM62x SoM is targeted for Display system application solutions for automotive and industrial
Base Linux package will be provided by TI. Tessolve provides ready to use SDK which can be used on application specific carrier board and for end application development
| Module Name | AM62x - SMARC-SoM |
|---|---|
| Processor |
|
| Memory |
|
| Ethernet | 2x 10/100/1000 ports |
| USB | 2x USB 2.0 |
| Multimedia |
|
| Other Interfaces |
|
| Automotive Network | 3x CAN/ CAN-FD |
| Operating Voltage Range | 5V DC @ 3A |
| Temperature Range | -40 Deg C to +105 Deg C |
| Form Factor | 82 mm x 50 mm |
| Part Number – SOM | Description |
|---|---|
| M2A-AM62xx-0.5G32G-IT | 512MB RAM/32GB Flash (Temp:-40°C to +85°C) |
| M2A-AM62xx-0.5G32G-AT | 512MB RAM/32GB Flash (Temp:-40°C to +105°C) |
| M2A-AM62xx-1G32G-IT | 1GB RAM/32GB Flash, (Temp:-40°C to +85°C) |
| M2A-AM62xx-1G32G-AT | 1GB RAM/32GB Flash (Temp:-40°C to +105°C) |
| M2A-AM62xx-2G64G-IT | 2GB RAM/64GB Flash, (Temp:-40°C to +85°C) |
| M2A-AM62xx-2G64G-AT | 2GB RAM/64GB Flash (Temp:-40°C to +105°C) |
Note: Please contact Tessolve for other memory configurations
Tessolve SEMICONDUCTOR introduces compact application board based on AM62x SMARC SoM targeting Industrial Gateway, Industrial HMI panel, Automotive In-cabin Monitoring and Automotive Cluster applications.
